Tetrafluoromethane/Carbon Tetrafluoride/CF4

CF4 gas application

Semiconductor Applications (Reactive Ion Etching):

• High Fluorine Content: CF4 has a 4:1 fluorine-to-carbon ratio, leading to a high concentration of highly reactive fluorine (F) and trifluoromethyl (CF3) radicals.
• Aggressive Etching: The abundance of these radicals makes CF4 plasmas highly effective for etching semiconductor materials.
• Minimal Film Formation: Unlike some other fluorocarbon gases, CF4 plasmas typically do not deposit significant amounts of fluorocarbon films on the etched surfaces. This is crucial for maintaining precise control over the etching process.

Other Applications:

• Plasma Chamber Cleaning: CF4 can be used to remove residues from the interior of plasma processing chambers.
• Expansion Agent: It’s employed in the production of certain types of plastics (polyolefins and polyurethanes) to control their physical properties.
• Aerosol Propellant: CF4 has been used as a propellant in some aerosol products.
• Fire Extinguishing Agent: Its non-flammable and chemically inert nature makes it suitable for fire suppression systems.
• Gaseous Dielectric: CF4 can be used as an insulating medium in high-voltage electrical equipment due to its excellent dielectric properties.

Important Note:

• Environmental Concerns: While CF4 has valuable applications, it is a potent greenhouse gas with a very long atmospheric lifetime. Its use is therefore subject to increasing environmental regulations.