Hexachlorodisilane/HCDS

Product Code GC-003
CAS Number 13465-77-5
Assay (purity) 99.8%
Purity Method by GC
Molecular Weight 268.88 g/mol
Form gas
Appearance colorless
Sensitivity
Melting Point −1 °C
Molecular Formula Si2Cl6
Linear Formula

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Safety Information

Signal Word Danger
Pictograms

Hazard Statements H227, H314, H318, H335
Precautionary Statements P280 ,P210, P260, P264, P271P301+P330+P331,P303+P361+P353,P304+P340,P370+P378,P403+P233,P403+P235,P405, P501
UN 2987
Transport Description Chlorosilanes, corrosive, n.o.s. (hexachlorodisilane)
Hazardous Class 8
Packing Group II
In TSCA Registry Yes

Certificates of Analysis (CoA)

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External Identifiers

Pubchem CID
SMILES [Si]([Si](Cl)(Cl)Cl)(Cl)(Cl)Cl
IUPAC Name Hexachlorodisilane
InchI Identifier InChI=1S/Cl6Si2/c1-7(2,3)8(4,5)6
InchI Key LXEXBJXDGVGRAR-UHFFFAOYSA-N

Other Customers Often Ask:

Some key properties of Hexachlorodisilane

  • Stability: It’s relatively stable under inert conditions (air or nitrogen) at high temperatures (up to 400°C).
  • Reactivity: It readily decomposes in the presence of Lewis bases, even at room temperature, forming dodecachloroneopentasilane and silicon tetrachloride.
    • Chemical Equation: 4 Si₂Cl₆ → 3 SiCl₄ + Si₅Cl₁₂
  • Applications:
    • Semiconductor Industry: This decomposition reaction is crucial for producing silicon-based components used in semiconductors, including those found in photovoltaic cells (solar panels).
    • Deoxygenation Reactions: Hexachlorodisilane acts as a reagent for deoxygenating various compounds, such as phosphine oxides. This involves removing oxygen from the compound.

In summary: Hexachlorodisilane is a valuable compound with both stability and reactivity, making it useful in various applications, particularly in the semiconductor and chemical industries.

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